@Article{jomm.19020203, AUTHOR = {Yu Zhang; Abhishek Vikram; Ming Tian; Tianpeng Guan; Jianghua Leng; Baojun Zhao; Lei Yan; Wei Hu; Guojie Chen; Hui Wang; Gary Zhang; Wenkui Liao}, TITLE = {Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images}, JOURNAL = {Journal of Microelectronic Manufacturing}, VOLUME = {2}, YEAR = {2019}, PAGES = {19020203}, URL = {http://www.jommpublish.org/p/183/28/}, DOI = {10.33079/jomm.19020203} }