TY - JOUR Yu Zhang; Abhishek Vikram; Ming Tian; Tianpeng Guan; Jianghua Leng; Baojun Zhao; Lei Yan; Wei Hu; Guojie Chen; Hui Wang; Gary Zhang; Wenkui LiaoT1 - Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images JO - Journal of Microelectronic Manufacturing VL - 2 Y1 - 2019/06/28 UR - http://www.jommpublish.org/p/183/28/ L1 - http://www.jommpublish.org/jomm_data/publish/6A/C7/34/01229546F4AF4FC9B891441791/NEW_10.33079.jomm.19020203.pdf DO - 10.33079/jomm.19020203 ER -