TY  - JOUR
Kun Yu; Hua WangT1  - Hard IP Core Nondestructive Testing Technology
JO  - Journal of Microelectronic Manufacturing
VL  - 2
Y1  - 2019/06/10
UR  - http://www.jommpublish.org/p/183/27/
L1  - http://www.jommpublish.org/jomm_data/publish/C2/50/48/FB409F4CCDAAAD9683F8DCF9E7/10.33079.jomm.19020201.pdf
DO  - 10.33079/jomm.19020201
ER  -