TY  - JOUR
Jikang Liu; Chenye Li; Jia WeiT1  - An Introduction on the IC Packaging Technology of FOPLP
JO  - Journal of Microelectronic Manufacturing
VL  - 
Y1  - 2025/05/10
UR  - http://www.jommpublish.org/p/55/82/
L1  - http://www.jommpublish.org/jomm_data/publish/0C/22/BC/90582E45D3A7E7E55DCFC00DAC/10.33079.jomm.25051001_KyTxq5u.pdf
DO  - 10.33079/jomm.25051001
ER  -