Welcome to Journal of Microelectronic Manufacturing!
Current Status of the Integrated Circuit Industry in ChinaEDA Industry Review
Authors: Litho World
Issue 3: 19020305, 2019 | PDF
Research Article
Published: Sept. 29, 2019
Abstract: China's IC industry has been flourishing in recent years, huge market demand together with government investments are the major driving forces for this development. The status and development momen...
An Innovative Method to Improve Model Accuracy by Implementing Multi-models Scheme for 28nm Node and Below
Authors: Qingchen Cao, Tianhui Li, Deyuan Xiao
Institution:SiEn (QingDao) Integrated Circuits Co., Ltd
Keywords:Image quality;lithography;OPC model;multi-model
Issue 3: 19020304, 2019 | PDF
Research Article
Published: Sept. 28, 2019
Abstract: As the process comes into 28nm node and below, lithography struggles stronger between high resolution (high NA) and enough process window especially for hole layers (Contacts and Vias). Taking more...
Influence of Chemical Stability on the Fabrication of MnGa-based Devices
Authors: Lijun Zhu, Jianhua Zhao
Institution:Cornell University
Keywords:Keyword: Chemical stability, Perpendicular magnetic anisotropy, Spintronics, Wet etching
Issue 3: 19020303, 2019 | PDF
Published: Sept. 26, 2019
Abstract: Ferromagnetic films of L10-ordered MnGa have shown promise not only in the applications in ultrahigh-density magnetic recording and spintronic memories, oscillators, and sensors, ...
A Flexible Pressure Sensor Based on Poly(dimethylsiloxane) Nanostructures Film
Authors: Man Zhang, Liangping Xia, Suihu Dang et al.
Institution:Yangtze Normal University
Keywords:Flexible;pressure sensor;poly(dimethylsiloxane);soft nanoimprint lithography;triboelectrostatic charges
Issue 3: 19020302, 2019 | PDF
Published: Sept. 26, 2019
Abstract: This paper proposed a flexible pressure sensor based on poly(dimethylsiloxane) nanostructures film and report an efficient, simple, and low-cost fabrication strategy via soft nanoimprint lithograph...
Innovation on Line Cut Methods of Self-aligned Multiple Patterning
Authors: Jeff Shu
Keywords:self-aligned multiple patterning;SAMP;self-aligned double patterning;SADP;self-aligned quadruple patterning;SAQP;line cut;edge placement error
Issue 3: 19020301, 2019 | PDF
Research Article
Published: Sept. 25, 2019
Abstract: Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeati...
Patterning Defect Study for Process Integration Engineering Using Pattern Fidelity Monitoring with Review SEM Images
Authors: Yu Zhang, Abhishek Vikram, Ming Tian et al.
Institution:Shanghai Huali Microelectronics Corp, ., Pudong District, Shanghai
Keywords:Die-to-database Pattern Monitor;After Develop Inspection (ADI);After Etch Inspection (AEI);SEM Review;CDSEM;pattern centric;pattern monitor
Issue 2: 19020203, 2019 | PDF
Research Article
Published: June 28, 2019
Abstract: Normally the optical wafer inspection tools are used for advanced process control in high volume manufacturing of semiconductor devices. The SEM Review is done for limited sample of inspection defe...
Issue 2: 19020205, 2019 | PDF
Research Article
Published: June 28, 2019
Development and Prospect of Process Models and Simulation Methods for Atomic Layer Deposition
Authors: Lei Qu, Rui Chen, Xiaoting Li et al.
Institution:North China University of Technology, China
Keywords:thin film deposition;atomic layer deposition;growth model;prediction model;simulation method
Issue 2: 19020204, 2019 | PDF
Research Article
Published: June 26, 2019
Abstract: Thin film deposition is one of the most important processes in IC manufacturing. In this paper, several typical models and numerical simulation methods for thin film deposition and atomic layer dep...
EUV Lithography: State-of-the-Art Review
Authors: Nan Fu, Yanxiang Liu, Xiaolong Ma et al.
Institution:HiSilicon Technologies Co, ., Ltd, Shanghai
Keywords:EUV lithography;EUV review;mask 3D;line edge roughness;EUV light source
Issue 2: 19020202, 2019 | PDF
Research Article
Published: June 19, 2019
Abstract: Although several years delayed than its initial plan, extreme UV lithography (EUVL) with 13.5nm wavelength has been finally implemented into high volume manufacture (HVM) of mainstream semiconducto...
Hard IP Core Nondestructive Testing Technology
Authors: Kun Yu, Hua Wang
Institution:Sino IC Technology Co, ., Ltd, ., Shanghai
Keywords:hard IP core;system on chip (SOC);testing technology;evaluation circuit;memory;automatic test equipment (ATE)
Issue 2: 19020201, 2019 | PDF
Research Article
Published: June 10, 2019
Abstract: Based on the analysis of the existing hard IP core testing technology, the hard IP core nondestructive testing technology was studied, according to the verification requirements of a large number o...