Yu-Hao Tsai, Du Zhang, Mingmei Wang
TEL Technology Center
Conducting all-in-one etch process for 3D-NAND fabrication requires close etch rate (E/R) for SiO2 and Si3N4; however, to attain comparable and high etch rate for b...
Yansong Liu, Chao Zhao, Lisong Dong et al.
Key Laboratory of Microelectronic Devices, &, Integrated Technology, Institute of Microelectronics of Chinese Academy of Sciences
micro-sieves；high volume manufacturing；defect free；high yield
Micro-sieves have been widely used in medical treatment, quarantine, environment, agriculture, pharmacy and food processing. However, the manufacturing and yield improvement have been difficult due...