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Online ISSN: 2578-3769


Study of Inverse Lithography Approaches based on Deep Learning
Authors: Xianqiang Zheng, Xu Ma, Shengen Zhang et al.
Institution:Key Laboratory of Photoelectronic Imaging Technology and System of Ministry of Education of China, School of Optics and Photonics, Beijing Institute of Technology, China
Keywords:Computational lithography;inverse lithography technology (ILT);optical proximity correction (OPC);deep learning
Volume 3, Issue 3: 20030301, 2020 | PDF
Research Article
Published: Oct. 7, 2020
Abstract: Computational lithography (CL) has become an indispensable technology to improve imaging resolution and fidelity of deep sub-wavelength lithography. The state-of-the-art CL approaches are capable o...
An Innovative Method to Improve Model Accuracy by Implementing Multi-models Scheme for 28nm Node and Below
Authors: Qingchen Cao, Tianhui Li, Shuying Wang et al.
Institution:SiEn (QingDao) Integrated Circuits Co., Ltd
Keywords:Image quality;lithography;OPC model;multi-model
Volume 2, Issue 3: 19020304, 2019 | PDF
Research Article
Published: Sept. 28, 2019
Abstract: As the process comes into 28nm node and below, lithography struggles stronger between high resolution (high NA) and enough process window especially for hole layers (Contacts and Vias). Taking more...
Innovation on Line Cut Methods of Self-aligned Multiple Patterning
Authors: Jeff Shu
Keywords:self-aligned multiple patterning;SAMP;self-aligned double patterning;SADP;self-aligned quadruple patterning;SAQP;line cut;edge placement error
Volume 2, Issue 3: 19020301, 2019 | PDF
Research Article
Published: Sept. 25, 2019
Abstract: Self-aligned multiple patterning (SAMP) can enable the semiconductor scaling before EUV lithography becomes mature for industry use. Theoretically any small size of pitch can be achieved by repeati...
Hotspot Detection of Semiconductor Lithography Circuits Based on Convolutional Neural Network
Authors: Xingyu Zhou, Youling Yu
Institution:Tongji University, Shanghai
Keywords:lithography;hotspot detection;CNN;deep learning
Volume 1, Issue 2: 18010205, 2018 | PDF
Research Article
Published: Dec. 27, 2018
Abstract: In the advanced semiconductor lithography manufacturing process, the sub-wavelength lithography gap may cause lithographic error and the difference between the wafer pattern and mask pattern which ...
Variational Level-set Formulation for Lithographic Source and Mask Optimization
Authors: Yijiang Shen, Zhenrong Zhang
Institution:Guangdong University of Technology
Keywords:computational lithography;variational level set;source and mask optimization;coupling image
Volume 1, Issue 2: 18010203, 2018 | PDF
Research Article
Published: Dec. 20, 2018
Abstract: This paper addresses the contributing factors in lithographic source and mask optimization, namely, the accuracy of the image formation model and the efficiency of the inverse imaging calculations ...
Compressive Sensing Approaches for Lithographic Source and Mask Joint Optimization
Authors: Xu Ma, Zhiqiang Wang, Gonzalo R. Arce
Institution:Key Laboratory of Photoelectronic Imaging Technology and System of Ministry of Education of China, School of Optics and Photonics, Beijing Institute of Technology, China
Keywords:Computational lithography;source mask optimization (SMO);compressive sensing (CS);inverse problem
Volume 1, Issue 2: 18010202, 2018 | PDF
Research Article
Published: Dec. 13, 2018
Abstract: Source and mask joint optimization (SMO) is a widely used computational lithography method for state-of-the-art optical lithography process to improve the yield of semiconductor wafers. Nowadays, c...
Hamamatsu’s Products for Optical Inspection, Metrology and Monitoring to Improve Yield and Accuracy for Semiconductor Processes
Authors: Chenghao Xiang, Xusheng Zhou
Institution:Hamamatsu Photonics (China) Co., Ltd., Beijing
Keywords:optical semiconductor inspection/metrology/monitoring solutions;image sensor;light sources;mini-spectrometer;photomultiplier tubes/modules
Volume 2, Issue 1: 19020102, 2019 | PDF
Research Article
Abstract: Pursuing small critical dimensions (i.e. 14 nm or below) and high integration bring us lots of physical defects causing low yield and functionality failures for foundries. Under this circumstance, ...
Fast and Robust DCNN Based Lithography SEM Image Contour Extraction Models
Authors: Tao Zhou, Xuelong Shi, Chen Li et al.
Institution:Shanghai Integrated Circuits R, &, D Center Co, ., Ltd, ., Shanghai
Keywords:SEM images;contour extraction;machine leaning (ML);deep convolution neural network (DCNN);edge placement variation
Volume 4, Issue 1: 21040102, 2021 | PDF
Research Article
Published: March 25, 2021
Abstract: Scanning electron microscope (SEM) metrology is critical in semiconductor manufacturing for patterning process quality assessment and monitoring. Besides feature width and feature-feature space dim...
Development and Prospect of Process Models and Simulation Methods for Atomic Layer Deposition
Authors: Lei Qu, Rui Chen, Xiaoting Li et al.
Institution:North China University of Technology, China
Keywords:thin film deposition;atomic layer deposition;growth model;prediction model;simulation method
Volume 2, Issue 2: 19020204, 2019 | PDF
Research Article
Published: June 26, 2019
Abstract: Thin film deposition is one of the most important processes in IC manufacturing. In this paper, several typical models and numerical simulation methods for thin film deposition and atomic layer dep...
Analysis of Current Research Status of Plasma Etch Process Model
Authors: Xiaoting Li, Rui Chen, Lei Qu et al.
Institution:North China University of Technology
Keywords:plasma etching;etching model;simulation
Volume 1, Issue 1: 18010104, 2018 | PDF
Research Article
Published: Sept. 30, 2018
Abstract: This paper summarizes the status of the plasma etch process modeling research. It mainly introduces typical etching models employing the analytical method, geometric method, system identification m...